Coverage includes Hall-effect devices, galvano-magnetic devices, Ovshinsky devices, Gunn-effect devices etc., diodes, resistors and capacitors implemented in semiconductor form. Electrically controllable semiconductor devices e.g. bipolar devices i.e. bipolar transistors and thyristors, and unipolar devices e.g. FET devices etc.

See Derwent ITP ‘Integrated circuits’ which includes details of semiconductor integrated circuit devices e.g. programmable logic devices, charge transfer devices, semiconductor memory etc.
ISSN 1463-7820

Includes all aspects of electrical connections, and includes arrangements for forming direct wire connections e.g. soldering, welding and riveting, crimping etc. of electrically conductive members in direct contact.

Details of terminal strips and blocks e.g. for printed circuits, and different cable types, and terminal strips e.g. distributor blocks. Coverage includes all aspects of electrical connectors, e.g. single-pole, two-pole and triple-pole two-part connectors, and connectors for specific applications e.g. HF, domestic mains, coaxial cables, ribbon cables and printed circuits connectors, and connector details characterised by application to specific industries e.g. telecommunications and aerospace etc. Apparatus and processes for connector manufacture, assembly and repair.

Also includes high power connectors for power distribution applications. See also 'Cable Installations' Derwent ITP for details of cable or line installations for power distribution.
ISSN 1463-7863

All aspects of arrangements for electrical illumination e.g. electrical discharge lamps and tubes, incandescent lamps etc.

See Derwent ITP ‘Electronic Displays and Display Applications’ which includes image display tubes e.g. CRTs and electron gun tubes, and fluorescent display tubes for display and imaging applications e.g. in video cameras.
ISSN 1463-7898

This profile covers details of instruments per se. for the measurement of electrical and electronic properties and values in general, without regard to specific applications e.g. for measuring or locating electrical faults in cables or components. This title therefore includes a section covering details of the novel features of test and measuring instruments, e.g. details of voltmeters, kilowatt-hour meters, current-meters, oscilloscopes and remote meter reading etc.
ISSN: 1467-3088

The Derwent ITP is divided into two sections covering: switches, relays and contacts and switchgear. Includes details of discrete electrical switches e.g. contacts, switches and switch operating mechanisms, and electrical relays for low power applications. Derwent ITP also includes switchgear, contacts and special switching arrangements for power applications.

See the Derwent ITP ‘Electrical switchgear and circuit isolation’ for details of circuits and devices for isolating electrical equipment and installations. Including protection circuits and devices for electrical circuits and installations, and protection from faults in electrical equipment.
ISSN 1463-7839

Includes details of sources and amplifiers of coherent optical (i.e. IR, visible light and UV) and other electromagnetic waves. Aspects directly involved with construction, operation, parameter control and monitoring of lasers, including details of laser types e.g. gas, semiconductor and solid-state lasers, construction of optical resonators or active medium, pumping of active medium within laser, control of laser parameters, cooling aspects, laser measurements and testing, laser assembly and correction schemes for laser beam parameters outside resonator.

Discrete semiconductor optoelectronic devices e.g. LEDs, and semiconductor lasers, and details of elements used as part of integrated circuits or arrays.
ISSN 1463-7782

Includes components for coupling, guiding e.g. optical waveguides, and for operating (e.g. multiplexing) on IR, visible or UV radiation. Includes details of optical elements; light guides, optical fibres, lenses, reflectors, refractors and polarisers etc., coupling arrangements for light guides, light guide installation and optical element parameter measurements.

Includes details of arrangements for light control e.g. modification of optical properties of medium electrically, magnetically, acoustically and mechanically e.g. by stress or force etc. and by using light i.e. non-linear optics. Also includes light switching arrangements and electro- or magneto-optical materials. Includes applications of optical fibres e.g. gyroscopes, interferometers, endoscopes etc.

See Derwent ITPs: 'Light emitting optoelectronic devices' or 'Radiation sensitive devices' for coverage of radiation sources and receivers.
ISSN 1463-7790

Includes details of all aspects of structural details and type of discrete passive electronic elements e.g. resistors, capacitors and inductors, and applications of e.g. inductive components to power supplies, communications etc.

Includes details of resistors and capacitors implemented in semiconductor form, and passive components used in power applications.

See Derwent ITP ‘Discrete semiconductor devices’ for details of semiconductor components used for switching and amplifying electronic signals, e.g. transistors, diodes, thyristors etc.
ISSN 1463-7812

Includes scanning techniques, infra-red and special projector optics. Sights. Lenses, mirrors, prisms and arrays. Head-up displays. LCD, LED displays. Fibre optic components and networks. Holographic systems. Range finding/distance measurement.
[ISSN 1463-5933]

Coverage includes printed connections for PCBs for providing electrical connections to or between printed circuits. Includes general printed circuit manufacturing arrangements e.g. details of processes for removing or applying conductive material, and secondary processes e.g. polishing and cleaning. Includes electric component assembly e.g. soldering, surface mounting and wiring details, and component removal.

Covers ‘types’ of PCB e.g. multilayer, ceramic, double-sided, flexible etc., and substrate details. Test and inspection arrangements for bare and loaded board, e.g. for conductivity and soldering, and test fixture arrangements e.g. using contact probes or automatic test equipment. PCB exposure details, blanking, shearing and cutting, multistep manufacturing processes for PCBs and materials recovery details. Also includes details of printed circuit connectors.
ISSN 1463-7855

Includes details of materials and structures for discrete semiconductor radiation sensitive devices for direct energy conversion e.g. solar cells, and photoreceivers for controlling current flow e.g. photoresistors, photothyristors and phototransistors etc., and receivers structurally combined with light emitters e.g. optocouplers and optoisolators. Semiconductor devices sensitive to X-Ray, gamma ray, particle and ions.

Charge transfer devices and radiation sensors and detectors formed as integrated circuits e.g. image pick-up arrangements and charge transfer devices e.g. integrated CCD devices for imaging applications.

Thermoelectric devices i.e. radiation pyroelectric detectors and thermo-magnetic devices and sensors and devices with junction of dissimilar materials; Peltier effect, power generating and heat extracting thermoelectric devices, and thermoelectric sensors.

Radiation and particle detectors; radiation sensing tubes. Also devices for radiation measurements using particular detection arrangements.
ISSN 1463-7804

Includes all aspect of static electromechanical devices that convert one form of energy into another used in e.g. measurement or sensing applications.

Transducer details relevant to audio equipment are also covered by the Derwent ITP 'Audio Input/Output Circuits and Transducers'

See separate Derwent ITP ‘Electrical Machines - Motors and Generators’ for details of rotary transducers e.g. small electrical machines, motors and generators.
ISSN 1463-7871

Includes all aspects of device type and manufacture of electronic valves, discharge tubes and CRTs. Coverage includes details of; gas-filled tubes e.g. plasma display panels and tubes, classical vacuum tubes and cold cathode devices, transit-time tubes, cathode-ray tubes; electron beam tubes, X-Ray tubes; ion beam tubes, tubes for processing and examining objects, radiation and particle detectors, particle spectrometer or separator tubes, thermionic generators; secondary emission tubes; electron multipliers; ion pumps; pressure measuring tubes and discharge tube manufacture.

Discharge tubes for lighting are covered by the 'Electrical lighting' Derwent ITP. See Derwent ITP ‘Electronic Displays and Display Applications’ for details of image display tubes e.g. CRTs and electron gun tubes, and fluorescent display tubes for display and imaging applications e.g. in video cameras.
ISSN 1463-7847