Includes preparation of materials for conductive polymers and the production of electro-conductive polymers from both intrinsically conductive and normally intractable polymers.
[ISSN 1463-5909]

Covers all aspects of materials used in semiconductor technology, including semiconductor materials per se. and other materials used for mechanical and/or chemical treatment during semiconductor manufacture e.g. abrasives, polishers, cleaners, etchants, gases etc.

Coverage includes the preparation of semiconductor materials from impure precursors, materials refining and purification, novel semiconductor materials and dopants. Piezoelectric, electrostrictive and magnetostrictive materials and liquid crystal and electrochromic materials. Includes magnetic materials and thick and thin film materials including substrate materials e.g. novel materials for multilayer ceramic substrates.

Covers semiconductor crystal growth including methods for growing monocrystals of i.e. silicon and germanium e.g. pulling from melt crystal growth, and wafer production. Details of materials and processes which change the fundamental characteristics of the substrate material through e.g. dopants.

See Derwent ITP `Semiconductor substrate processing� for details of e.g. active material deposition, doping, lithography, etching, and semiconductor manufacturing equipment in general.
ISSN 1463-7596

Covers preparation of III-V and II-VI type semiconductor materials, for example GaAs and HgTe, and their use in the design and manufacture of electronic devices.
[ISSN 1463-5925]

Includes packages, mountings and terminals for semiconductor devices e.g. substrates and mountings used in integrated circuit packaging, and multilayer circuit packages e.g. high density interconnect, and multilayer ceramic substrate details. Discrete device package structures e.g. two or three terminal packages, and special package structures e.g. window structures for image sensors or ROM devices, and package protection from e.g. radiation.

Cooling, heating and ventilating arrangements for semiconductor packages. Lead-frames, terminals, interconnections and wiring layout details.

Coverage includes assembly for semiconductor packages including attaching leads to packages e.g. wire bonding, tape automated bonding, and flip-chip technology. Encapsulation details e.g. mould design and materials for resin encapsulation, package assembly and chip handling including die attachment to e.g. paddle of lead frame or refractory ceramic packages.

Includes wafer handling details e.g. wafer holders and conveyors for storage or transport e.g. transfer between processing stations, and wafer protection during transport and storage.
ISSN 1463-7618

Coverage includes distinct categories of processing including the deposition of active materials e.g. of semiconductor layers through CVD, introduction of impurities (dopants) during growth or deposition of material, and heat, electrical and radiation treatment of semiconductor body.

Includes all aspects of photolithography and beam-lithography, mask manufacture, exposure and alignment details. Etching and chemical treatment processes e.g. wet, dry, beam etching to produce patterned structures, and nature of material being etched e.g. silicon, conducting and insulating layers etc.

Semiconductor manufacturing equipment in general including sputtering, vapour deposition, plasma and molecular beam epitaxy apparatus, and semiconductor manufacture process control details. Multi-step processes for semiconductor device manufacture.

Coverage includes techniques used for particular devices or technologies e.g. gallium arsenide or FET.

For details of semiconductor materials per se. and other materials used in semiconductor manufacture, see Derwent ITP `Materials for semiconductor technology�.
ISSN 1463-760X

Covers measuring, positioning and orientation techniques during semiconductor manufacturing processes. Includes details of measuring the properties of the active semiconductor material e.g. doping level, wafer conductivity and carrier mobility etc., and the level and nature of defects in the material e.g. inherent stress.

Film parameter measurements during semiconductor processing including using beam scanning e.g. to detect wafer surface defects such as dust on wafer surface, and film thickness measurements e.g. for deposited layer. Covers measurements using image recognition equipment and optical or electron microscopy.

Includes measurements on individual semiconductor chips after separation from wafer, and equipment for testing circuits and devices at wafer level. Also covers testing the electrical properties of discrete semiconductor components and integrated circuits.

Testing circuit packages, chip carriers and multilayer boards e.g. bonding strength test, detection of abnormal bonding, air-tightness test, moisture resistance of encapsulation, lead or bump inspection.

Derwent ITP `Computer hardware testing� includes details of error monitoring, detection and correction equipment for computer hardware.
ISSN 1463-7626

Covers novel compositions, perovskites, ceramics. Fabrication by sintering, sputtering, extrusion, vapour deposition. Electrical applications. Conductors. Magnets and coils for nuclear fusion. NMR. Electronic applications. SQUIDs. Josephson junction devices. Superconducting thin films and, for example, integrated circuits.
[ISSN 1463-5941]